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Notes： Following the Career (Cree) and Philips Lumileds, the light-emitting diode (LED) chip manufacturing giant Osram Opto Semiconductors (Osram Opto Semiconductor) recently announced, will be in Penang, Malaysia (Penang) and Germany Fort NVC root ( Regensburg) into 6-inch fab production line to further expand manufacturing capacity.

    OSRAM Opto Semiconductors at the plant in Penang, Malaysia has been in full swing 6-inch fab expansion project.

    OSRAM Opto Semiconductors CEO AldoKampe said the company is the value of OSRAM LED supply chain, a very important part, and by extension high-performance indium gallium nitride (InGaN) chip manufacturing capacity will help it continue to consolidate the market position, from the fast-growing LED market profit.

    OSRAM Opto Semiconductors light LED chip factory in Penang, opening about two years ago, is now in full swing by the expansion and transformation of the original 4-inch 6-inch wafer plant is expected to increase total production to approximately 25,000 area m, and can create some period of four hundred new jobs. The NVC will reconfigure the root Fort Factory space available and they are being transferred to 6-inch production line, the fastest in the summer of 2011, to on-line mass production. The company estimates that the next 6 inches of new capacity added, will enable the white LED chip manufacturing capacity to double as much as the end of 2012.

    OSRAM Opto Semiconductors pointed out that the main impact of the expansion of production capacity to the use of film and UX: 3 InGaN chip technology, which is necessary for the production of white LED chips, and these chips from the outset in the 6-inch wafer factory production, rather than the original 4-inch plant.

    It is understood that 6-inch wafers per unit surface area is about four times the 3-inch wafers, 2 inch wafer of nine times, more than double the 4-inch wafer. If we can ensure that the yield of new capacity to the current manufacturing standards and quality on top, it would greatly improve the overall productivity and cost structure, to enhance the market competitiveness of great help.

    In fact, LG Innotek, Cree and Philips Lumileds has also been announced in 2010 into 6-inch wafer production line, which, LG Innotek and Philips Lumileds also has taken the lead mass production, and Career in the Triangle, North Carolina Research Park (Research Triangle Park) 6-inch wafer fab is expected to be completed in June 2011 trial production operation.

    Once each 6-inch LED chip maker opened a new full capacity, is set to further accelerate the LED lighting, automotive and consumer electronics applications, such as penetration, and still use the small size of the LED chip wafer fabrication business caused by a very threat.
  At present, the semiconductor LED as energy saving, environmental protection, the main technique has been incorporated into the national long-term technology development plan with the "Eleventh Five-Year" national "863" high-tech industries of major projects, and has been strongly supported. However, China's current development and application of LED products, many deficiencies still exist areas. China's own LED chips, wafer production is still limited, products mainly low-grade, large gap with foreign countries. Small-scale industry can only meet the domestic demand for packaging companies 20% -30%, most high-performance high-power LED and LED products have to rely on imports. In addition, the application of the LED market, there are also the product range, the variety of constraints caused by uneven problems, especially in the field of general lighting, due to technical deficiencies, it can not scale generalizable. Therefore, the promotion of LED packaging technology development efforts to enhance its own core technologies and achieve the scale of production is the development of LED industry, the most critical step. A, LED lighting industry trends and analysis 1. High-power LED highlighting the rapid growth momentum has gradually become a mainstream product In 2008, the global LED market reached 80 billion U.S. dollars, the LED products in the market share increased from 40% in 2001 to grow to more than 70% in 2005, including high brightness LED in the 1995-2004 average annual growth rate between 46%. U.S. market research firm Communications In-dustry Researchers (CIR) predicts that the global LED market size of over 30% annual growth rate, market size in 2009 will exceed 100 billion U.S. dollars. In recent years, with LED lighting, small-size panel backlighting, and interior lighting applications such as the gradual expansion of new, high brightness LED has been in the past few years, rapid growth stage, the LED will gradually increase in the proportion and has become the mainstream LED products. 2. Technological breakthroughs general lighting, lighting a huge opportunity to upgrade the engineering industry The field of general lighting, lighting accounts for 90% of the market share. Following the semiconductor lighting as incandescent, fluorescent, energy saving lamp, the fourth generation of revolutionary new high efficiency solid light source, with a long life, energy saving, environmental protection and other significant advantages. LED application areas but mainly in the special lighting, the U.S., Japan, Korea, Europe, China and Taiwan in terms of LED technology have been launched special national research plan, if used for general illumination technology, once mature, will face a of 500 million lighting market share re-divide, so lighting a huge opportunity to upgrade the engineering industry. 3. China's LED lighting industry should be to package high-end products and product upgrades direction light In the LED field, there are three elements, namely, the growth of light-emitting semiconductor wafer, chip and package. Currently there are three links in the low-end applications still have a certain foundation. But in the key, especially in the growth part of the wafer, and the world class level there is a large gap. At present, China's industrial advantages, mainly in packaging, regional distribution of output from the package, the output value of packaging in 2008, about 25 billion U.S. dollars, has already surpassed Japan, Taiwan became the world's largest packaging areas, and have the core competitiveness of the market and technology. But the attention of state and government which does not have much, if Taiwan and Japan and other countries from the economic crisis or out of remission at any time may form the dominance of Japan, Taiwan and the United States, Qi Jin, Europe and Korea in the "equal shares" of the distribution pattern We will once again lose the initiative and opportunity. Therefore, we should upgrade the existing industrial advantages, the high-end products to the packaging effort, while the direction of lighting technology in general more effort to break through barriers to technology patents LED industry, fostering competitive advantage in emerging markets. (1) the current state for the entire LED industry chain focus on the upstream extension of the two chips and the downstream part of lighting applications. Gradually upstream investment funds have been great, but with little success, but upstream of the leading international widening. Downstream products and also because product quality problems, uneven, difficult to ensure stable long-life use of effects. This will cause users to doubt China's LED products and more conservative and negative attitude. So that each aspect of feedback to government leaders and national attention to rectify the LED market before, the end result is a "halt", led to the need to spend a lot of manpower and national resources, the introduction of foreign advanced packaging technology of leading enterprises to guide Guonei downstream products, so we will once again lose the entire LED industry, the right to speak, the domestic market channels will be occupied by the form of OEM. (2) up to now, because the four leading enterprises (CREE, PHILPS, OSRAM, Nichia Chemical) have different technical routes and patent monopoly protection, and the immaturity of their packaging and other reasons, so now the industry has not yet A LED light on the standards. If our advanced LED light source enterprises and units, especially those with core technology for high-power LED light source advanced enterprises and units in the government support and promotion, organization of scientific research personnel, conduct a new design and development of technical standards , adhere to the scientific practice and the basic principles of innovation and development will be in the global LED industry, this one in the upper reaches at least make substantial breakthroughs. If participation in the international and guidance on the final development of international standards, will be the power of science and technology of China Aerospace Science and Technology, following the scientific initiative after another, thus directly in the LED industry, our country's international influence have changed the fundamental understanding, to a new level. Second, high-power LED light source with the advantages of core technology LED is generally from the wafer - silicon - light - lamp composed of four links, middle and lower reaches in the LED industry, the key point is how the application of thermal resistance and junction temperature to resolve such key issues as a prerequisite, to maintain a stable and effective chip light output. All along, LED light source for general lighting applications, the existence of light metal material with high thermal conductivity problem, apply the heat balance, long-lasting fluorescent light problems and problems with bottlenecks in the four core technologies: 1 core technologies: metal material with high thermal conductivity Currently on the swimming dragon enterprises, such as chips can be done CREE has luminous efficiency can reach 130-150lm / W. But the LED junction temperature directly affects the level of LED light extraction efficiency, device lifetime, reliability, emission wavelength. Maintain the LED junction temperature within the allowable range, is the preparation of high-power LED chips, packaged devices and device applications must focus on every aspect of the key factors, especially the application of LED device packaging and device design must focus on solving the core problem. Applications are now mainstream to encapsulate the substrate material is aluminum, but aluminum plate package heat and light conversion efficiency of the chip are the core technology bottlenecks exist, can not effectively control the junction temperature and stable to maintain a high light output power and optical applications because of the chip The higher efficiency required the greater area of the aluminum plate will increase the cost and application size, very inconvenient. So how to get out of this misunderstanding of new paths is a central feature of the new technology. Core Technology 2: heat balance technique LED device structure with patented key technologies of heat balance cooling, and passive cooling in low-cost way to maintain the premise, the use of high thermal conductivity media, through the new device / light overall structure, succeeded in reducing the thermal resistance junction reduce the PN junction temperature, the PN Results of work within the allowable operating temperature to maintain the large number of photons output. Its characteristics are as follows: (1) ultra-low thermal resistance material, the overall structure of rapid cooling techniques; (2) high thermal conductivity, UV resistant packaging technology; (3) application of low environmental stress structure technology; (4) the overall thermal resistance of <20K / W, junction temperature "80 degrees; (5) LED illumination control module operating temperature below 65 ℃. 3 core technologies: the application of efficient phosphor Common on the market today phosphor white LED light application of technology is to GaN chip and yttrium aluminum garnet (YAG) package together to make the technology Nichia Chemical of Japan in the late 90s of last century invention, and the formation of patent monopoly. GaN blue chip fat (λp = 465nm, Wd = 30nm), high-temperature sintering of YAG containing Ce3 + phosphor, excited by this yellow and blue light emission, peak 550nm. Blue LED substrate cavity installed in the reflective bowl, cover with thin layer of resin mixed with YAG, about 200-500nm. LED substrate phosphor emitted blue light is absorbed, and some blue and yellow light emitted phosphor mixture can be too white. Theory for In-GaN/YAG white LED, by changing the chemical composition of YAG phosphor and adjust the thickness of the phosphor layer can be obtained color temperature 3500-10000K in colored white. But the traditional process based on white LED or blue with the LED, so when the color temperature is too high, the color will shift to the blue, and produce color drift, a certain light pollution. Must be used in reducing the light efficiency, lower overall thermal resistance of the circumstances, be achieved relative stability, but the decay is not optimistic. The first has been the commercialization of products for blue chip with YAG yellow phosphor, the luminous efficiency of its best is about 35 lm / W, YAG and more Asian companies to Japan's import prices in 2000 yuan / kg ; The second is the Japanese Sumitomo Electric has developed the material to ZnSe white LED, but less luminous efficiency. Core technology 4: LED time with the application of optical The current global LED industry, the mainstream approach is the formation of the package LED light source or light source module chip after the time of the lamps made to conduct with light, so the original is used in the practice of traditional light sources, because the traditional light source is 360 ° . If you want the light guide to the application side, Philips is currently the best of a traditional lamp, the light loss is 40%. And our many domestic manufacturers of downstream applications, LED lamps are in fact the optical parameters of the optical parameters of the chip or the light source, rather than indicators of the overall parameters of the optical lamps. Now the most advanced scientific method is done on the chip package with light, a light guide out of the chip to maintain maximum light output so that light loss rate of only 5% -10%. As technology continues to improve, the light loss rate will be lower and lower light source efficiency is increasing. Light source such as lamps with no need to do with light, the relative efficiency of the lamp will be greatly enhanced, making it more widely used to functional lighting, forming a considerable scale of the market channels. LED junction temperature measurement. LED installation requirements have been put to the radiators, and is a constant current drive for power. At the same time connected to the LED should go out two lines cited. Previously put in the power connected to the output voltage meter (LED's positive and negative), then connect the power, not heat up while the LED before and immediately read the voltmeter reading, which is equivalent to the value of V1, and then wait at least 1 hour, so it has reached thermal equilibrium, and then measured again, LED voltage across the equivalent of V2. Subtract these two values, the difference obtained. Longer be removed 4mV look to a junction temperature can be drawn. In fact, LED mostly in series and then parallel to many, that does not matter, when the voltage difference between the LED in series by many of the common contribution, so should the voltage difference divided by the LED in series divided by the number of go 4mV, you can get the junction temperature. For example, LED strings 2 and 10, the first measured voltage is 33V, the second time after the heat balance of the measured voltage is 30V, the voltage difference of 3V. This number divided by the first LED series number (10), are 0.3V, divided by 4mV, can be 75 degrees. Assume that the environment before starting the temperature is 20 degrees, this time the junction temperature should be 95 degrees.
[2012-1-31]
[2012-1-17]
[2012-1-9]
[2012-1-7]
 
 
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